Dual-core processors with leading-edge chipsets, graphics capability and BGA packaging offer all-in-one platform
AMD (NYSE: AMD) announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform. The AMD Turion™ Neo X2 processor Model L625 and the AMD Athlon™ Neo X2 processor Model L325 deliver PC-caliber performance in a very low power envelope and with an embedded-friendly ball grid array (BGA) package.
This embedded client solution is ideal for traditional embedded applications such as single board computing and thin client systems, as well as markets for self-service kiosks, point of sale machines and digital signage. The ball grid array (BGA) package helps alleviate potential reliability issues for systems that are …